Suoyi Spherical silica powder

Characteristics of spherical silica powder ✨
1. High sphericity: The particles are close to perfect spherical shape, with excellent flowability (easy to fill, no bridging), and processing and dispersion far exceed angular powders.
2. Low specific surface area/low oil absorption value: The surface is smooth, with few pores and low oil absorption rate, which can significantly reduce the amount of resin/adhesive used and increase the solid content of the system.
3. High purity/low impurities: Electronic grade can reach 99.9%+, with extremely low metal ions (Na ⁺, Fe ³ ⁺, etc.), no heavy metal pollution, suitable for high-end electronic scenes.
4. High hardness/high wear resistance: The Mohs hardness is about 7, which is wear-resistant, impact resistant, scratch resistant, and improves the service life of the material.
5. High thermal stability/insulation: melting point of about 1713 ℃, high temperature resistance, low coefficient of thermal expansion; Excellent electrical insulation, non-conductive, and resistant to breakdown.
6. Low internal stress/high filling: Spherical particles are uniformly stressed, and after filling, the material has low internal stress and is not easily cracked; Can achieve high filling volume (up to 80%+), reducing costs and increasing efficiency.
7. Chemical inertness: acid and alkali resistant, solvent resistant, does not react with most substrates, improves material weather resistance and corrosion resistance.
The main application areas of spherical silica powder 📌
1. Electronics and Semiconductors
-Epoxy plastic encapsulation material (EMC): a core filling material that enhances the thermal conductivity, insulation, low stress, and high reliability of the packaging body, suitable for chip/IC packaging.
-Copper clad laminate (CCL)/printed circuit board (PCB): reduces the thermal expansion coefficient of the board, improves thermal conductivity and flame retardancy, and is suitable for 5G/high-frequency high-speed boards.
-Electronic glue/potting glue: used for LED, power supply, sensor potting, thermal insulation, anti settling, easy to apply.
-Wafer polishing/grinding: CMP polishing solution abrasive, high precision, low damage, high flatness, used in silicon wafer/chip processes.
2. High end coatings and inks
-Industrial anti-corrosion/high temperature resistant coatings: improve hardness, wear resistance, weather resistance, and temperature resistance, used for ships, wind power, and steel structures.
-Powder coating: improves fluidity, powder coating rate, coating smoothness, reduces gloss, and enhances hand feel.
-UV/water-based ink: low oil absorption, high dispersion, improves printing clarity and wear resistance.
3. Engineering plastics and composite materials
-PA/PC/PP/epoxy modification: high filling, low warpage, low shrinkage, enhanced rigidity and heat resistance, used for automotive and electronic structural components.
-Thermal conductive composite material: Combined with alumina/boron nitride, prepare high thermal conductivity insulating plastic/adhesive for use in heat dissipation devices.
4. Ceramics and refractory materials
-Precision ceramics (alumina/zirconia based): used for sintering, improving density and strength, in ceramic bearings, cutting tools, and seals.
-Refractory castables/coatings: high temperature resistance, thermal shock resistance, low thermal conductivity, used for metallurgy and kiln lining.
5. Other fields
-Rubber/elastomer: reinforced, wear-resistant, and reduces permanent compression deformation, used for seals, tires, and rubber hoses.
-Cosmetics: matte, smooth, oil absorption, sunscreen, for powder, powder, sunscreen (physical sunscreen).
-Medicine/Food: Inert, flow aid, anti caking, used as a pharmaceutical excipient and food anti caking agent.